Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867888 | Component carrier comprising at least one heat pipe and method for producing said component carrier | Jonathan Silvano de Sousa, Bernhard Reitmaier, Erich Schlaffer, Wolfgang Schrittwieser, Gerald Weidinger +2 more | 2020-12-15 |
| 10861636 | Inductor made of component carrier material comprising electrically conductive plate structures | Gerald Weidinger, Heinz Moitzi | 2020-12-08 |
| 10863631 | Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure | Timo Schwarz, Mario Schober | 2020-12-08 |
| 10779413 | Method of embedding a component in a printed circuit board | Timo Schwarz, Andreas Zluc, Gregor Langer | 2020-09-15 |
| 10665526 | Component carrier comprising at least one heat pipe and method for producing said component carrier | Jonathan Silvano de Sousa, Bernhard Reitmaier, Erich Schlaffer, Wolfgang Schrittwieser, Gerald Weidinger +2 more | 2020-05-26 |
| 10617012 | Methods of manufacturing flexible printed circuit boards | Andreas Zluc | 2020-04-07 |