Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863631 | Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure | Johannes Stahr, Timo Schwarz | 2020-12-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863631 | Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure | Johannes Stahr, Timo Schwarz | 2020-12-08 |