Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847400 | Adhesive-less substrate bonding to carrier plate | Sriskantharajah Thirunavukarasu, Karrthik Parathithasan, Qi Jie Peng, Manorajh Arunakiri | 2020-11-24 |
| 10651126 | Methods and apparatus for wafer-level die bridge | Chien-Kang HSIUNG | 2020-05-12 |
| 10636696 | Methods for forming vias in polymer layers | Yu Gu, Guan Huei See, Peng Suo, Prayudi Lianto | 2020-04-28 |
| 10566226 | Multi-cassette carrying case | Sriskantharajah Thirunavukarasu, Eng Sheng Peh, Srinivas D. Nemani, Avinash Avula, Ellie Yieh +2 more | 2020-02-18 |
| 10549324 | Method and apparatus for backside cleaning of substrates | Sriskantharajah Thirunavukarasu, Jen Sern Lew, Srinivas D. Nemani | 2020-02-04 |