Issued Patents 2020
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10866936 | Model object management and storage system | David Lisuk, Daniel Erenrich, Guodong Xu, Luis Voloch, Simon Slowik +4 more | 2020-12-15 |
| 10867978 | Integrated circuit module with integrated discrete devices | Milind S. Bhagavat | 2020-12-15 |
| 10831846 | Adjusting search results based on overlapping work histories | — | 2020-11-10 |
| 10825692 | Semiconductor chip gettering | Milind S. Bhagavat, Ivor G. Barber, Venkatachalam Valliappan, Yuen Ting Cheng, Guan Sin Chok | 2020-11-03 |
| 10798029 | System and apparatus for generation of multiple automated ephemeral chat messages | Ajeet Singh Kushwaha, Rimaljit Kaur | 2020-10-06 |
| 10784274 | 3-dimensional flash memory with increased floating gate length | Srivardhan Gowda, Krishna K. Parat | 2020-09-22 |
| 10727204 | Die stacking for multi-tier 3D integration | Milind S. Bhagavat | 2020-07-28 |
| 10714462 | Multi-chip package with offset 3D structure | Milind S. Bhagavat, Gabriel H. Loh | 2020-07-14 |
| 10713192 | Data transmission system and data transmission method | Maurizio Paganini, Alan Osamu Kobayashi, Ramakrishna Chilukuri, Nobuhiro Yanagisawa, Sujan Thomas | 2020-07-14 |
| 10628834 | Fraud lead detection system for efficiently processing database-stored data and automatically generating natural language explanatory information of system results for display in interactive user interfaces | Diane Wu | 2020-04-21 |
| 10593628 | Molded die last chip combination | Milind S. Bhagavat | 2020-03-17 |
| 10593620 | Fan-out package with multi-layer redistribution layer structure | Milind S. Bhagavat, Priyal Shah | 2020-03-17 |
| 10585837 | Data transmission method and data transmission system | Alan Osamu Kobayashi, Sujan Thomas, Ramakrishna Chilukuri, Iyothsna Nagaraja | 2020-03-10 |
| 10573630 | Offset-aligned three-dimensional integrated circuit | Brett P. Wilkerson, Milind S. Bhagavat, Dmitri Yudanov | 2020-02-25 |
| 10535526 | Thin film metal silicides and methods for formation | Robert W. Carpick, Frank Streller, Filippo Mangolini | 2020-01-14 |
| 10529693 | 3D stacked dies with disparate interconnect footprints | Milind S. Bhagavat | 2020-01-07 |