Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10501664 | Resin compositon, removable adhesive layer, IC substrate, and IC packaging process | KUO-SHENG LIANG, Mei-Ju Pan, Yu-Cheng Huang | 2019-12-10 |
| 10428238 | Resin composition, polyimide film and method for manufacturing polyimide film | MING-JAAN HO, SHOU-JUI HSIANG, NAN-KUN HUANG, YU-WEN KAO, CHIA-YIN TENG +1 more | 2019-10-01 |
| 10423069 | Water soluble photosensitive resin composition and film using same | CHEN-FENG YEN, Chang-Hung Lee, Yi-Fang Lin, YEN-CHIN HSIAO, SHOU-JUI HSIANG | 2019-09-24 |
| 10329368 | Photosensitive resin composition, and film and printed circuit board using same | CHEN-FENG YEN, SHOU-JUI HSIANG, YEN-CHIN HSIAO | 2019-06-25 |