Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10448540 | Ultrathin heat dissipation structure | Ning Hou, Cong Lei, Biao Li | 2019-10-15 |
| 10428238 | Resin composition, polyimide film and method for manufacturing polyimide film | Mao-Feng Hsu, SHOU-JUI HSIANG, NAN-KUN HUANG, YU-WEN KAO, CHIA-YIN TENG +1 more | 2019-10-01 |
| 10365430 | Method for manufacturing high frequency signal transmission structure and high frequency signal transmission structure obtained thereby | XIAN-QIN HU, FU-YUN SHEN, Feng Hu | 2019-07-30 |
| 10321561 | Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board | XIAN-QIN HU | 2019-06-11 |
| 10299367 | Circuit board having conductive polymer | HSIAO-TING HSU | 2019-05-21 |
| 10278307 | Cooling plate and method for manufacturing thereof | XIAN-QIN HU, FU-YUN SHEN, HSIAO-TING HSU | 2019-04-30 |
| 10205487 | Wireless power consortium device and method for manufacturing the same | XIAN-QIN HU, FU-YUN SHEN | 2019-02-12 |