Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10501664 | Resin compositon, removable adhesive layer, IC substrate, and IC packaging process | KUO-SHENG LIANG, Mei-Ju Pan, Mao-Feng Hsu | 2019-12-10 |
| 10412835 | Package substrate | — | 2019-09-10 |
| 10390384 | Apparatuses and methods for reducing circuit switch fallback (CSFB) call setup time | Chien-Chun Huang-Fu, Yu-Syuan Jheng, Jou-Man Lin | 2019-08-20 |
| 10278153 | Method and apparatus for avoiding circuit-switched call drop in mobile communications | Chien-Chun Huang-Fu, Marko Niemi | 2019-04-30 |