Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10501664 | Resin compositon, removable adhesive layer, IC substrate, and IC packaging process | Mei-Ju Pan, Mao-Feng Hsu, Yu-Cheng Huang | 2019-12-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10501664 | Resin compositon, removable adhesive layer, IC substrate, and IC packaging process | Mei-Ju Pan, Mao-Feng Hsu, Yu-Cheng Huang | 2019-12-10 |