Issued Patents 2019
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522498 | Systems of bonded substrates and methods for bonding substrates with bonding layers | Masao Noguchi | 2019-12-31 |
| 10515871 | Cooling devices having large surface area structures, systems incorporating the same, and methods of forming the same | Naoya Take | 2019-12-24 |
| 10500661 | Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom | Hannes Greve, F. Patrick McCluskey | 2019-12-10 |
| 10505106 | Encapsulated PCM switching devices and methods of forming the same | Naoya Take | 2019-12-10 |
| 10490482 | Cooling devices including jet cooling with an intermediate mesh and methods for using the same | Naoya Take | 2019-11-26 |
| 10489525 | Systems and methods for composite thermal interface material microstructure property prediction | Masao Noguchi, Ercan Mehmet Dede | 2019-11-26 |
| 10461668 | Systems for protecting and monitoring power electronic devices | — | 2019-10-29 |
| 10459475 | Method and mechanisms to use phase change material to improve occupant comfort in automobiles | Umesh N. Gandhi, Brian J. Pinkelman | 2019-10-29 |
| 10453777 | Power electronics assemblies with cio bonding layers and double sided cooling, and vehicles incorporating the same | Ercan Mehmet Dede | 2019-10-22 |
| 10403594 | Hybrid bonding materials comprising ball grid arrays and metal inverse opal bonding layers, and power electronics assemblies incorporating the same | Ercan Mehmet Dede | 2019-09-03 |
| 10388590 | Cooling bond layer and power electronics assemblies incorporating the same | Ercan Mehmet Dede | 2019-08-20 |
| 10385469 | Thermal stress compensation bonding layers and power electronics assemblies incorporating the same | Ercan Mehmet Dede | 2019-08-20 |
| 10381223 | Multilayer composite bonding materials and power electronics assemblies incorporating the same | — | 2019-08-13 |
| 10377407 | Cooling systems for vehicle interior surfaces | Brian J. Pinkelman, Umesh N. Gandhi | 2019-08-13 |
| 10354462 | Fault diagnosis in power electronics using adaptive PCA | Lingyi Zhang, Weiqiang Chen, Krishna Pattipatti, Ali M. Bazzi, Ercan M. Dede | 2019-07-16 |
| 10347601 | Power electronics assemblies with metal inverse opal bonding, electrical contact and cooling layers, and vehicles incorporating the same | Ercan Mehmet Dede | 2019-07-09 |
| 10290911 | Cooling loops and vehicles incorporating the same | Feng Zhou, Ercan Mehmet Dede | 2019-05-14 |
| 10267568 | Programmable ultrasonic thermal diodes | Ercan Mehmet Dede, Feng Zhou | 2019-04-23 |
| 10231364 | Fluidly cooled power electronics assemblies having a thermo-electric generator | Ercan Mehmet Dede, Chi-Ming Wang | 2019-03-12 |
| 10224265 | Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system | Yuji Fukuoka, Ercan Mehmet Dede, Feng Zhou | 2019-03-05 |
| 10206310 | Electronics assemblies incorporating three-dimensional heat flow structures | Hiroshi Ukegawa, Yanghe Liu, Feng Zhou, Ercan Mehmet Dede | 2019-02-12 |
| 10174659 | Switchable radiative energy harvesting systems | Debasish Banerjee, Shashi Honnikoppa | 2019-01-08 |