Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224265 | Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system | Ercan Mehmet Dede, Shailesh N. Joshi, Feng Zhou | 2019-03-05 |
| 10192814 | Electronic assemblies having a cooling chip layer with fluid channels and through substrate vias | Ercan Mehmet Dede, Kyosuke Miyagi | 2019-01-29 |