Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10500661 | Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom | Hannes Greve, Shailesh N. Joshi | 2019-12-10 |
| 10232472 | Transient liquid phase sinter pastes and application and processing methods relating thereto | Hannes Greve | 2019-03-19 |
| 10180035 | Soldered components for downhole use | Chandradip Pravinbhai Patel, Mark Kostinovsky, Francis Dupouy, Glen Dell Schilling, Gilles Iafrate | 2019-01-15 |