Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424528 | Layered cooling structure including insulative layer and multiple metallization layers | Feng Zhou, Ercan Mehmet Dede | 2019-09-24 |
| 10334756 | Manifold structures having an integrated fluid channel system and assemblies comprising the same | Ercan Mehmet Dede, Jongwon Shin, Jae Seung Lee | 2019-06-25 |
| 10206310 | Electronics assemblies incorporating three-dimensional heat flow structures | Hiroshi Ukegawa, Feng Zhou, Shailesh N. Joshi, Ercan Mehmet Dede | 2019-02-12 |