Issued Patents 2019
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522343 | Method of enhancing high-k film nucleation rate and electrical mobility in a semiconductor device by microwave plasma treatment | Robert D. Clark | 2019-12-31 |
| 10483109 | Self-aligned spacer formation | Robert D. Clark | 2019-11-19 |
| 10460988 | Removal method and processing method | Takeshi ITATANI, Tadahiro Ishizaka, Kai-Hung Yu, Wanjae Park | 2019-10-29 |
| 10453681 | Method of selective vertical growth of a dielectric material on a dielectric substrate | Takashi Matsumoto, Yusaku Kashiwagi, Gerrit J. Leusink | 2019-10-22 |
| 10453749 | Method of forming a self-aligned contact using selective SiO2 deposition | Sangcheol Han, Soo Doo Chae | 2019-10-22 |
| 10453737 | Method of filling retrograde recessed features with no voids | — | 2019-10-22 |
| 10410861 | Method of filling retrograde recessed features | Gerrit J. Leusink | 2019-09-10 |
| 10410858 | Selective film deposition using halogen deactivation | Takaaki Tsunomura | 2019-09-10 |
| 10381448 | Wrap-around contact integration scheme | Robert D. Clark | 2019-08-13 |
| 10381234 | Selective film formation for raised and recessed features using deposition and etching processes | — | 2019-08-13 |
| 10378105 | Selective deposition with surface treatment | Kai-Hung Yu, Takahiro Hakamata, Subhadeep Kal, Gerrit J. Leusink | 2019-08-13 |
| 10283369 | Atomic layer etching using a boron-containing gas and hydrogen fluoride gas | Robert D. Clark | 2019-05-07 |
| 10217670 | Wrap-around contact integration scheme | Satoru Nakamura, Soo Doo Chae, Akiteru Ko, Kaoru Maekawa, Gerrit J. Leusink | 2019-02-26 |
| 10217825 | Metal-insulator-semiconductor (MIS) contacts and method of forming | Robert D. Clark | 2019-02-26 |