Issued Patents 2019
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224265 | Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system | Yuji Fukuoka, Shailesh N. Joshi, Feng Zhou | 2019-03-05 |
| 10209016 | Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same | Tsuyoshi Nomura | 2019-02-19 |
| 10206310 | Electronics assemblies incorporating three-dimensional heat flow structures | Hiroshi Ukegawa, Yanghe Liu, Feng Zhou, Shailesh N. Joshi | 2019-02-12 |
| 10192814 | Electronic assemblies having a cooling chip layer with fluid channels and through substrate vias | Yuji Fukuoka, Kyosuke Miyagi | 2019-01-29 |
| 10193047 | Electronic assemblies incorporating heat flux routing structures for thermoelectric generation | — | 2019-01-29 |
| 10176316 | Systems and methods for providing and detecting thermal energy patterns in electronic devices | Paul Donald Schmalenberg | 2019-01-08 |