Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283424 | Wafer structure and packaging method | Tsui-Mei Chen, Pei-Haw Tsao, Cheng-Te Lin, Li-Huan Chu | 2019-05-07 |
YL
Yu-Jung LIN
Overall (2019): #205,588 of 560,194Top 40%
1
Patents 2019