Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510633 | Package and printed circuit board attachment | Pei-Haw Tsao, Tsung-Hsing Lu | 2019-12-17 |
| 10506712 | Printed circuit board | Pei-Haw Tsao, Tsung-Hsing Lu | 2019-12-10 |
| 10373901 | Semiconductor structure and manufacturing method thereof | Pei-Haw Tsao, Tsung-Hsing Lu | 2019-08-06 |
| 10283424 | Wafer structure and packaging method | Tsui-Mei Chen, Pei-Haw Tsao, Cheng-Te Lin, Yu-Jung LIN | 2019-05-07 |