Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283424 | Wafer structure and packaging method | Pei-Haw Tsao, Cheng-Te Lin, Yu-Jung LIN, Li-Huan Chu | 2019-05-07 |
TC
Tsui-Mei Chen
Overall (2019): #235,647 of 560,194Top 45%
1
Patents 2019