Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510633 | Package and printed circuit board attachment | Tsung-Hsing Lu, Li-Huan Chu | 2019-12-17 |
| 10506712 | Printed circuit board | Tsung-Hsing Lu, Li-Huan Chu | 2019-12-10 |
| 10475719 | Semiconductor structure and manufacturing method thereof | Chien-Jung Wang | 2019-11-12 |
| 10373901 | Semiconductor structure and manufacturing method thereof | Tsung-Hsing Lu, Li-Huan Chu | 2019-08-06 |
| 10304793 | Package structure and method for forming the same | Tsung-Hsing Lu | 2019-05-28 |
| 10283424 | Wafer structure and packaging method | Tsui-Mei Chen, Cheng-Te Lin, Yu-Jung LIN, Li-Huan Chu | 2019-05-07 |