Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290550 | Strain enhancement for FinFETs | Tsung-Lin Lee, Chih Chieh Yeh, Feng Yuan, Hung-Li Chiang | 2019-05-14 |
| 10256180 | Package structure and manufacturing method of package structure | Wen-Chun Liu | 2019-04-09 |