Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276542 | Package structure and manufacturing method thereof | Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen, Hua-Wei Tseng, Jo-Mei Wang +1 more | 2019-04-30 |
KL
Kuan-Chung Lu
Overall (2019): #378,979 of 560,194Top 70%
1
Patents 2019