Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483120 | Hybrid double patterning method for semiconductor manufacture | Wen-Li Cheng, Dong-Yo Jheng, Chih-Ming Lai, Ru-Gun Liu | 2019-11-19 |
| 10418252 | Fin-like field effect transistor patterning methods for increasing process margins | Chin-Yuan Tseng, Wei-Liang Lin, Hsin-Chih Chen, Shi Ning Ju, Yung-Sung Yen +1 more | 2019-09-17 |
| 10410863 | Methods for integrated circuit design and fabrication | Tsong-Hua Ou, Shih-Ming Chang, Wen-Chun Huang, Chih-Ming Lai, Ru-Gun Liu +1 more | 2019-09-10 |
| 10410913 | Multi-layer metal contacts | Ming-Feng Shieh, Wen-Hung Tseng, Chih-Ming Lai, Tsai-Sheng Gau, Ru-Gun Liu | 2019-09-10 |
| 10388523 | Lithographic technique for feature cut by line-end shrink | Yung-Sung Yen, Chun-Kuang Chen, Ko-Bin Kao, Ru-Gun Liu | 2019-08-20 |
| 10382292 | Quality assessment and decision recommendation for continuous deployment of cloud infrastructure components | Pankaj Kumar Singh, Sree Krishna Chaitanya Vadrevu, Ze Li, Murali Mohan Chintalapati, Yingnong Dang | 2019-08-13 |
| 10274829 | Multiple patterning decomposition and manufacturing methods for IC | Wen-Li Cheng, Pai-Wei Wang, Ru-Gun Liu, Chih-Ming Lai | 2019-04-30 |
| 10276394 | Hybrid double patterning method for semiconductor manufacture | Wen-Li Cheng, Dong-Yo Jheng, Chih-Ming Lai, Ru-Gun Liu | 2019-04-30 |
| 10276377 | Method for patterning interconnects | Yung-Sung Yen, Yu-Hsun Chen, Chen-Hau Wu, Chun-Kuang Chen, Ta-Ching Yu +2 more | 2019-04-30 |