Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446406 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng +6 more | 2019-10-15 |
| 10446964 | High density connector and wafer group | — | 2019-10-15 |
| 10418252 | Fin-like field effect transistor patterning methods for increasing process margins | Chin-Yuan Tseng, Wei-Liang Lin, Shi Ning Ju, Ken-Hsien Hsieh, Yung-Sung Yen +1 more | 2019-09-17 |
| D840939 | Right-angle power connector | — | 2019-02-19 |