Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504735 | Method of forming a semiconductor device by high-pressure anneal and post-anneal treatment | Huicheng Chang, Cheng-Po Chau, Wen-Yu Ku, Yi-Fan Chen, Chun-Yen Peng | 2019-12-10 |
| 10269900 | Semiconductor film with adhesion layer and method for forming the same | Chi-Ming Liao, Chun-Heng Chen, Sheng-Po Wu, Ming-Feng Hsieh | 2019-04-23 |