Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504735 | Method of forming a semiconductor device by high-pressure anneal and post-anneal treatment | Hongfa Luan, Huicheng Chang, Wen-Yu Ku, Yi-Fan Chen, Chun-Yen Peng | 2019-12-10 |