Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388584 | Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die | Reza A. Pagaila, Byung Tai Do | 2019-08-20 |
| 10388612 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Pandi C. Marimuthu +1 more | 2019-08-20 |