Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388584 | Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die | Byung Tai Do, Linda Pei Ee Chua | 2019-08-20 |