Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10474033 | Method and apparatus for post exposure processing of photoresist wafers | Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani +2 more | 2019-11-12 |
| 10372834 | Creating and using an integrated technical data package | Dan Z. Sokol, Robert A. Roush, Randy Strobel | 2019-08-06 |
| 10373864 | Systems and methods for wetting substrates | Paul R. McHugh, Bridger Earl HOERNER, Marvin L. Bernt, Thomas H. Oberlitner, Brian Aegerter +3 more | 2019-08-06 |
| 10203604 | Method and apparatus for post exposure processing of photoresist wafers | Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani +2 more | 2019-02-12 |
| 10174437 | Wafer electroplating chuck assembly | Michael Windham | 2019-01-08 |