Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483239 | Semiconductor device including dual pad wire bond interconnection | Junrong Yan, Harjashan Veer Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu +1 more | 2019-11-19 |
| 10283485 | Semiconductor device including conductive bump interconnections | Junrong Yan, Chee Keong Chin, Kim Lee Bock, Mingxia Wu | 2019-05-07 |