Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283485 | Semiconductor device including conductive bump interconnections | Junrong Yan, Xiaofeng Di, Chee Keong Chin, Kim Lee Bock | 2019-05-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283485 | Semiconductor device including conductive bump interconnections | Junrong Yan, Xiaofeng Di, Chee Keong Chin, Kim Lee Bock | 2019-05-07 |