Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483239 | Semiconductor device including dual pad wire bond interconnection | Junrong Yan, Xiaofeng Di, Gokul Kumar, Chee Keong Chin, Ming Xia Wu +1 more | 2019-11-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483239 | Semiconductor device including dual pad wire bond interconnection | Junrong Yan, Xiaofeng Di, Gokul Kumar, Chee Keong Chin, Ming Xia Wu +1 more | 2019-11-19 |