Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361351 | Semiconductor light emitting element package including solder bump | Chang Hoon Kwak, Sung Jin Ahn, Hak Hwan Kim, Jin Kweon Chung, Min Jung Kim | 2019-07-23 |
| 10319511 | Coil component | — | 2019-06-11 |
| 10211372 | Semiconductor light emitting device | Sung-Joon Kim, Su Hyun Jo, Seung Hwan Lee, Tae Sung Jang | 2019-02-19 |
| 10170242 | Composite electronic component, method of manufacturing the same, board for mounting thereof, and packaging unit thereof | Dae Bok Oh, Jae Young Park, Ichiro Tanaka, Chang-Ho Lee | 2019-01-01 |