Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361351 | Semiconductor light emitting element package including solder bump | Chang Hoon Kwak, Sung Jin Ahn, Jin Hwan Kim, Jin Kweon Chung, Min Jung Kim | 2019-07-23 |
HK
Hak Hwan Kim
Overall (2019): #451,909 of 560,194Top 85%
1
Patents 2019