Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361351 | Semiconductor light emitting element package including solder bump | Chang Hoon Kwak, Hak Hwan Kim, Jin Hwan Kim, Jin Kweon Chung, Min Jung Kim | 2019-07-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361351 | Semiconductor light emitting element package including solder bump | Chang Hoon Kwak, Hak Hwan Kim, Jin Hwan Kim, Jin Kweon Chung, Min Jung Kim | 2019-07-23 |