Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170242 | Composite electronic component, method of manufacturing the same, board for mounting thereof, and packaging unit thereof | Jin Hwan Kim, Dae Bok Oh, Ichiro Tanaka, Chang-Ho Lee | 2019-01-01 |