Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515837 | Method of wafer bonding of dissimilar thickness die | Eric R. Miller | 2019-12-24 |
| 10504777 | Method of manufacturing wafer level low melting temperature interconnections | Eric R. Miller, George Grama | 2019-12-10 |
| 10418406 | Hybrid sensor chip assembly and method for reducing radiative transfer between a detector and read-out integrated circuit | John L. Vampola, Barry M. Starr, Chad W. Fulk, Christopher L. Mears, John J. Drab | 2019-09-17 |
| 10236226 | In-situ calibration structures and methods of use in semiconductor processing | Robert M. Emerson, Michael V. Liguori | 2019-03-19 |