Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453731 | Direct bond method providing thermal expansion matched devices | — | 2019-10-22 |
| 10418406 | Hybrid sensor chip assembly and method for reducing radiative transfer between a detector and read-out integrated circuit | Sean P. Kilcoyne, John L. Vampola, Barry M. Starr, Chad W. Fulk, Christopher L. Mears | 2019-09-17 |
| 10354910 | Foundry-agnostic post-processing method for a wafer | Mary A. Teshiba | 2019-07-16 |
| 10354975 | Barrier layer for interconnects in 3D integrated device | Edward R. Soares | 2019-07-16 |
| 10242967 | Die encapsulation in oxide bonded wafer stack | Jason G. Milne | 2019-03-26 |