Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446466 | Mechanically improved microelectronic thermal interface structure for low die stress | Tse E. Wong, Yung-Cheng Lee | 2019-10-15 |
| 10242967 | Die encapsulation in oxide bonded wafer stack | John J. Drab | 2019-03-26 |