Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10458716 | Conformal thermal ground planes | Michael Hulse, William Francis | 2019-10-29 |
| 10446466 | Mechanically improved microelectronic thermal interface structure for low die stress | Jason G. Milne, Tse E. Wong | 2019-10-15 |