Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515905 | Semiconductor device with anti-deflection layers | Michael J. Rondon, Andrew Clarke | 2019-12-24 |
| 10504777 | Method of manufacturing wafer level low melting temperature interconnections | Sean P. Kilcoyne, Eric R. Miller | 2019-12-10 |