Issued Patents 2019
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522512 | Semiconductor package and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2019-12-31 |
| 10515936 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2019-12-24 |
| 10512890 | Apparatus for mixing materials which have a high mix proportion/ratio therebetween and preparation production system using the same | Yan-Lan Chiou | 2019-12-24 |
| 10438931 | Package structure and manufacturing method thereof | Han-Wen Lin, Shang-Yu Chang Chien, Nan-Chun Lin | 2019-10-08 |
| 10424526 | Chip package structure and manufacturing method thereof | Chi-An Wang, Wen-Hsiung Chang | 2019-09-24 |
| 10381278 | Testing method of packaging process and packaging structure | Shang-Yu Chang Chien, Nan-Chun Lin | 2019-08-13 |
| 10354978 | Stacked package including exterior conductive element and a manufacturing method of the same | Ming-Chih Chen, Yuan-Fu Lan, Chi-An Wang, Hsien-Wen Hsu | 2019-07-16 |
| 10332844 | Manufacturing method of package structure | Nan-Chun Lin | 2019-06-25 |
| 10300441 | Injection mixer | — | 2019-05-28 |
| 10276553 | Chip package structure and manufacturing method thereof | Chi-An Wang | 2019-04-30 |
| 10276526 | Semiconductor package structure and manufacturing method thereof | Nan-Chun Lin, Shang-Yu Chang Chien | 2019-04-30 |
| 10269671 | Package structure and manufacturing method thereof | Nan-Chun Lin | 2019-04-23 |
| 10249585 | Stackable semiconductor package and manufacturing method thereof | Yun-Hsin Yeh | 2019-04-02 |
| 10224254 | Package process method including disposing a die within a recess of a one-piece material | Ming-Chih Chen, Hsien-Wen Hsu, Yuan-Fu Lan | 2019-03-05 |
| 10177011 | Chip packaging method by using a temporary carrier for flattening a multi-layer structure | Nan-Chun Lin, Shang-Yu Chang Chien | 2019-01-08 |
| 10177060 | Chip package structure and manufacturing method thereof | Chi-An Wang | 2019-01-08 |
| 10170458 | Manufacturing method of package-on-package structure | Chi-An Wang | 2019-01-01 |