Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354978 | Stacked package including exterior conductive element and a manufacturing method of the same | Ming-Chih Chen, Hung-Hsin Hsu, Yuan-Fu Lan, Chi-An Wang | 2019-07-16 |
| 10224254 | Package process method including disposing a die within a recess of a one-piece material | Ming-Chih Chen, Yuan-Fu Lan, Hung-Hsin Hsu | 2019-03-05 |