Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424526 | Chip package structure and manufacturing method thereof | Hung-Hsin Hsu, Wen-Hsiung Chang | 2019-09-24 |
| 10354978 | Stacked package including exterior conductive element and a manufacturing method of the same | Ming-Chih Chen, Hung-Hsin Hsu, Yuan-Fu Lan, Hsien-Wen Hsu | 2019-07-16 |
| 10276553 | Chip package structure and manufacturing method thereof | Hung-Hsin Hsu | 2019-04-30 |
| 10177060 | Chip package structure and manufacturing method thereof | Hung-Hsin Hsu | 2019-01-08 |
| 10170458 | Manufacturing method of package-on-package structure | Hung-Hsin Hsu | 2019-01-01 |