Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522512 | Semiconductor package and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2019-12-31 |
| 10515936 | Package structure and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2019-12-24 |
| 10438931 | Package structure and manufacturing method thereof | Han-Wen Lin, Hung-Hsin Hsu, Nan-Chun Lin | 2019-10-08 |
| 10381278 | Testing method of packaging process and packaging structure | Hung-Hsin Hsu, Nan-Chun Lin | 2019-08-13 |
| 10276526 | Semiconductor package structure and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2019-04-30 |
| 10177011 | Chip packaging method by using a temporary carrier for flattening a multi-layer structure | Hung-Hsin Hsu, Nan-Chun Lin | 2019-01-08 |