Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10390440 | Solderless inter-component joints | Tsung Nan Lo | 2019-08-20 |
| 10211071 | IC packaging method and a packaged IC device | Wen-Hsuan Lin | 2019-02-19 |
| 10192837 | Multi-via redistribution layer for integrated circuits having solder balls | Wayne Hsiao, Richard Te Gan, James Spehar | 2019-01-29 |
| 10177021 | Integrated circuits and methods therefor | Wen-Hsuan Lin, Ju-Hsuan Ko, Chih-Hung Chang | 2019-01-08 |