Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10346339 | Signal path isolation for conductive circuit paths and multipurpose interfaces | Jingsong Zhou, Madan Mohan Reddy Vemula | 2019-07-09 |
| 10192837 | Multi-via redistribution layer for integrated circuits having solder balls | CHUNG-HSIUNG HO, Wayne Hsiao, Richard Te Gan | 2019-01-29 |