Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192837 | Multi-via redistribution layer for integrated circuits having solder balls | CHUNG-HSIUNG HO, Wayne Hsiao, James Spehar | 2019-01-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192837 | Multi-via redistribution layer for integrated circuits having solder balls | CHUNG-HSIUNG HO, Wayne Hsiao, James Spehar | 2019-01-29 |