WL

Wen-Hsuan Lin

NB Nxp B.V.: 2 patents #63 of 415Top 20%
Overall (2019): #108,103 of 560,194Top 20%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10211071 IC packaging method and a packaged IC device CHUNG-HSIUNG HO 2019-02-19
10177021 Integrated circuits and methods therefor CHUNG-HSIUNG HO, Ju-Hsuan Ko, Chih-Hung Chang 2019-01-08