Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10440834 | Resin fluxed solder paste, and mount structure | HIROHISA HINO, Yuki YOSHIOKA, Masato Mori, Yasuhiro Suzuki | 2019-10-08 |
| 10407604 | Heat-dissipating resin composition, and component and electronic device including the same | HONAMI NAWA, HIROHISA HINO, Arata Kishi, Yasuhiro Suzuki, Hidenori Miyakawa | 2019-09-10 |