Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10501628 | Resin composition, and electronic component and electronic device using same | HONAMI NISHINO | 2019-12-10 |
| 10440834 | Resin fluxed solder paste, and mount structure | Naomichi Ohashi, Yuki YOSHIOKA, Masato Mori, Yasuhiro Suzuki | 2019-10-08 |
| 10407604 | Heat-dissipating resin composition, and component and electronic device including the same | HONAMI NAWA, Arata Kishi, Naomichi Ohashi, Yasuhiro Suzuki, Hidenori Miyakawa | 2019-09-10 |