Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10464153 | Connecting method of circuit member | Hiroki Maruo | 2019-11-05 |
| 10407604 | Heat-dissipating resin composition, and component and electronic device including the same | HONAMI NAWA, HIROHISA HINO, Naomichi Ohashi, Yasuhiro Suzuki, Hidenori Miyakawa | 2019-09-10 |
| 10412834 | Mounting structure and method for manufacturing same | Hironori Munakata, Koji Motomura, Hiroki Maruo | 2019-09-10 |
| 10412838 | Conductive particle, and connection material, connection structure, and connecting method of circuit member | Hiroki Maruo | 2019-09-10 |